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Maipu Impresses at InteropTokyo 2024

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Maipu made a significant impact at InteropTokyo 2024, showcasing its latest products and solutions, including RoCEv2 DataCenter, SD-Campus, SD-WAN, Cloud Wi-Fi, and Cloud M2M.
Visitors to Maipu booth were highly engaged, with many expressing keen interest in the advanced capabilities and potential applications of these solutions.
Maipu's participation in InteropTokyo 2024 not only reinforced its position in the field but also opened up new opportunities for collaboration and growth. The positive response from attendees and the fruitful discussions held throughout the event underscored the success of Maipu's presence at the show.
We look forward to building on this momentum and continuing to innovate and lead in the tech industry. See you at InteropTokyo 2025!